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Thin film Deposition(박막 제조)

저작시기 2008.02 |등록일 2008.04.03 파워포인트파일MS 파워포인트 (ppt) | 9페이지 | 가격 1,500원

소개글

Thin film Deposition(박막 제조)에 에 관련된 ppt 자료 입니다.

목차

2. Thin film Deposition
2. Thin film Deposition-CD(1)
2. Thin film Deposition-CD(3)
2. Thin film Deposition-PD(1)
2. Thin film Deposition-PD(2)
2. Thin film Deposition-the others

본문내용

Thin Film : Thin material layers which thickness is about 1㎛ or less than that.
The reasons for application
Passivation.
Reduce the surface effect.
Interlevel Dielectrics
Classification
1) Chemical Deposition(CD)
2) Physical Deposition(PD)
2. Thin film Deposition-CD(1)
Chemical deposition
1) Plating
2) Chemical Solution Deposition
A. Process
Synthesis of the Precursor Solution
The Coating or Deposition Process
Heat Treatments
B. Advantage
Control of the exact composition on a molecular level.
Simplest and least expensive thin film fabrication processes.
Low temperature synthesis, coating a large deposition area
3) Chemical Vapor Deposition
2. Thin film Deposition-CD(2)
Chemical Vapor Deposition
: The wafer (substrate) is exposed to one or more volatile precursors, which rea
ct and/or decompose on the substrate surface to produce the desired deposit.
Advantage
- High Purity
- Low substrate damage
- Low cost
- Mass production
CVD processes often used for GaAs processing
1) Silicon dioxide
SiH4 + 2N2O → SiO2 + 2H2 +2N2, SiCl4 + O2 → SiO2 + 2Cl2
2) Silicon nitride
3SiH4 + 4NH3 → Si3N4 + 12H2 , 3SiCl2H2 + 4NH3 → Si3N4 + 6HCl + 6H2
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