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Multi Chip Module - D

저작시기 2008.02 |등록일 2008.04.03 파워포인트파일MS 파워포인트 (ppt) | 7페이지 | 가격 1,500원

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Multi Chip Module - D 에 관한 ppt 자료 입니다.

목차

Electrical Packaging
Multichip Module Technology
MCM-D(1)
MCM-D(2)
Electrical Chip Interconnections

본문내용

The general purposes of Electrical Packaging
Electrical Packaging
1. Power distribution
2. Signal distribution
3. Heat Dissipation
4. Proterction
The steps of Electrical Packaging
Electrical Packaging
Advantages of Multichip Module technology
1. Minimizing & Reducing the weight
2. Good electrical performance
3. Saving the cost
4. Connecting more chips
5. Easy to repair
Classification of Multichip Module technology
1. MCM-L(Organic Laminates)
2. MCM-C(Ceramics)
3. MCM-D(Deposited Dielectric) - Thin Film Module
Multichip Module Technology
Large area
Small area
Small area
Advantages of MCM-D
1. The best technique of MCM to minimize the module
2. Increase chip density
3. Better Electrical performance
Materials of MCM-D
- Substrate : Al2O3, Glass, BeO, SiC, Si
- Insulator : Polymide (ε=3.5), 불소화 폴리이미드(ε=2.5~2.9), Amorphous teflon(ε=2.0), Benzocyclobutane(BCB)(ε=2.7)
- Conductor : Copper, Aluminum
MCM-D(1)
MCM-D(2)
MCM-D Unit Process
a) Deposit the insulator
b) PR is exposed through a mask
c) Negative lithography
d) Patterning PR
e) Growth of copper layer
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