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bumping with solder

저작시기 2006.12 |등록일 2006.12.19 | 최종수정일 2014.06.30 파워포인트파일MS 파워포인트 (ppt) | 14페이지 | 가격 1,000원

소개글

솔더 볼을 올리는 방법에 관한 발표자료

목차

Solder Jet

Stud bumping( 자세히)


Solder ball transfer

본문내용

this is a process through which balls are aspirated and released by a pickup arm

then transferred to respective positions on the substrate where flux has been applied.

problems such as excess balls fixing onto the adhesive arm, or difficulties in transferring ballsonto substrates with warps on the surface.
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