솔더 볼을 올리는 방법에 관한 발표자료
Stud bumping( 자세히)
Solder ball transfer
this is a process through which balls are aspirated and released by a pickup arm
then transferred to respective positions on the substrate where flux has been applied.
problems such as excess balls fixing onto the adhesive arm, or difficulties in transferring ballsonto substrates with warps on the surface.